Electronic component, electronic apparatus, and moving object

ABSTRACT

An electronic component includes a wiring substrate, a heating element, a first support, a second support, and a container. The heating element, the first support, and the second support are electrically connected to the wiring substrate. Each of the first support and the second support includes a protrusion portion, and the protrusion portion of the second support is shorter than the protrusion portion of the first support.

This application is a continuation application of U.S. patentapplication Ser. No. 14/573,349, filed Dec. 17, 2014, which claimspriority to JP 2013-265011, filed on Dec. 24, 2013. The disclosures ofeach of these applications are hereby incorporated by reference in theirentireties.

BACKGROUND

1. Technical Field

The present invention relates to an electronic component, an electronicapparatus, and a moving object.

2. Related Art

Hitherto, electronic components including a resonation device such as aquartz crystal resonator have been required to be further reduced insize and thickness with the miniaturization and thinning of electronicapparatuses, and power consumption has also been required to be reducedin order to achieve energy saving. Particularly, in an electroniccomponent such as a crystal oscillator with a thermostat (OCXO) having astructure in which a constant ambient temperature of a quartz crystalresonator is maintained by heating the quartz crystal resonator and thevicinity thereof by a heating element in order to avoid the influence ofthe ambient temperature to thereby have a high frequency stability, heatfrom the heating element disposed on, for example, a substrate is notuniformly transferred to the entire substrate on which the quartzcrystal resonator and an oscillation component in the vicinity of thequartz crystal resonator are disposed. For this reason, it is difficultto control the temperature of the oscillation component disposed in thevicinity of the quartz crystal resonator, and thus there is a problem inthat a high frequency stability cannot be obtained.

In order to solve such a problem, JP-A-2007-6270 discloses a method ofincreasing frequency stability by providing a heat-conducting plate on asubstrate and transferring heat of a heating element to the entiresubstrate.

However, in the above-mentioned OCXO, lead terminals are connected tothe substrate on which the quartz crystal resonator and the heatingelement are disposed, and the lead terminals are extracted to theoutside of a package. Thus, when some of the lead terminals are used aslead terminals for adjustment or inspection, if the length of the leadterminal for adjustment or inspection is set to be equal to the lengthof a lead terminal connected to a mounting substrate on which the OCXOis mounted, there is a concern that the lead terminal for adjustment orinspection may come into contact with the mounting substrate. When thelead terminal for adjustment or inspection comes into contact with themounting substrate, heat from the heating element is transferred to themounting substrate and escapes. For this reason, the temperaturestability of the quartz crystal resonator and the oscillation componentare deteriorated, and thus there is the possibility of frequencystability being deteriorated.

SUMMARY

An advantage of some aspects of the invention is to solve at least apart of the problems described above, and the invention can beimplemented in the following forms or application examples.

Application Example 1

An electronic component according to this application example includes aheating element; a container; a first support which penetrates thecontainer, is mechanically connected to the container, and has a firstprotrusion portion protruding outside the container and a second supportwhich penetrates the container, is mechanically connected to thecontainer, and has a second protrusion portion protruding outside thecontainer; and a wiring substrate which has the heating element, thefirst support, and the second support being electrically connectedthereof and is disposed within the container through the first supportand the second support. The second protrusion portion is shorter thanthe first protrusion portion.

According to this application example, the protrusion portion of thesecond support is shorter than the protrusion portion of the firstsupport for connecting the electronic component on amounting substrate.Thus, when the electronic component is mounted on the mountingsubstrate, it is possible to prevent the protrusion portion of thesecond support from coming into contact with the mounting substrate.Therefore, it is possible to reduce the outflow of heat of the heatingelement to the mounting substrate along the protrusion portion of thesecond support. For this reason, there is an effect that it is possibleto reduce the radiation of heat of the heating element to the outsideand to obtain the electronic component with a high frequency stability.

Application Example 2

This application example is directed to the electronic componentaccording to the application example described above, wherein thecontainer has a projection port ion which protrudes in a protrusiondirection of the second protrusion portion, is longer than the secondprotrusion portion, and is shorter than the first protrusion portion.

According to this application example, a projection portion longer thanthe second protrusion portion and shorter than the first protrusionportion is provided, so that the projection portion serves as a stopperwhen mounting the electronic component on the mounting substrate, andthereby the second protrusion portion and the mounting substrate areprevented from coming into contact with each other. Thus, there is aneffect that it is possible to reduce the radiation of heat of theheating element to the outside and to obtain the electronic componentwith a high frequency stability.

Application Example 3

This application example is directed to the electronic componentaccording to the application example described above, wherein athickness of the second support is smaller than a thickness of the firstsupport.

According to this application example, the second support has athickness smaller than that of the first support, and thus may have areduced heat conduction as compared with the first support, therebyallowing heat emission from the second support close to the heatingelement to be further reduced. For this reason, there is an effect thatit is possible to reduce the radiation of heat of the heating element tothe outside and to obtain the electronic component with a high frequencystability.

Application Example 4

This application example is directed to the electronic componentaccording to the application example described above, wherein the secondprotrusion portion has a supporting portion and an end, and a thicknessof the end is larger than that of the supporting portion.

According to this application example, the end of the second protrusionportion has a thickness larger than that of the supporting portion.Accordingly, when the second support is used as a lead terminal foradjustment or inspection, there is a tendency for a probe for adjustmentor inspection to come into contact with the second support. For thisreason, it is possible to prevent an adjustment or inspection error fromoccurring due to contact failure with the probe, and thus there is aneffect that it is possible to obtain the electronic component withhigher accuracy.

Application Example 5

This application example is directed to the electronic componentaccording to the application example described above, wherein the firstsupport and the second support are connected to the container through aninsulating member.

According to this application example, in a portion in which the firstsupport and the second support penetrate the container, the firstsupport, the second support, and the container are connected to eachother through an insulating member such as glass having a low heatconductivity, and thus it is possible to reduce the radiation of heat ofthe heating element to the container along the first support and thesecond support. For this reason, there is an effect that it is possibleto obtain the electronic component with a high frequency stability.

Application Example 6

This application example is directed to the electronic componentaccording to the application example, wherein the electronic componentfurther includes a circuit component, and the circuit component iselectrically connected to the wiring substrate and includes anoscillation circuit and a resonator element.

According to this application example, the circuit component heated bythe heating element includes the oscillation circuit and the resonatorelement. For this reason, heat of the heating element is sufficientlytransferred to the oscillation circuit and the resonator element, andthus there is an effect that it is possible to obtain the electroniccomponent with a high frequency stability.

Application Example 7

This application example is directed to the electronic componentaccording to the application example described above, wherein theoscillation circuit, the resonator element, and the heating element aredisposed within a second container, and the second container is disposedon the wiring substrate.

According to this application example, when the oscillation circuit, theresonator element, and the heating element are disposed within thesecond container, heat of the heating element is efficiently transferredto the oscillation circuit and the resonator element. Thus, there is aneffect that it is possible to obtain the electronic component withhigher accuracy.

Application Example 8

An electronic apparatus according to this application example includesthe electronic component according to the application example describedabove.

According to this application example, there is an effect that it ispossible to reduce the outflow of heat of the heating element to theoutside and to obtain the electronic apparatus including an electroniccomponent with a high frequency stability.

Application Example 9

An electronic apparatus according to this application example includesthe electronic component according to the application example describedabove and a mounting substrate on which the electronic component isdisposed. The first support and the mounting substrate are connected toeach other, and the second support and the mounting substrate areseparated from each other.

According to this application example, it is possible to reduce theoutflow of heat of the heating element disposed in the electroniccomponent to the mounting substrate along the protrusion portion of thesecond support. For this reason, there is an effect that it is possibleto reduce the radiation of heat of the heating element to the outsideand to obtain the electronic apparatus including an electronic componentwith a high frequency stability.

Application Example 10

A moving object according to this application example includes theelectronic component according to the application example describedabove.

According to this application example, there is an effect that it ispossible to reduce the outflow of heat of the heating element to theoutside and to obtain the moving object including an electroniccomponent with a high frequency stability.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIGS. 1A and 1B are schematic configuration diagrams of an electroniccomponent according to a first embodiment of the invention; FIG. 1A is aplan view and FIG. 1B is a cross-sectional view taken along line A-A ofFIG. 1A.

FIG. 2 is an enlarged cross-sectional view of the vicinity of a secondsupport which is an electronic component according to a secondembodiment of the invention.

FIGS. 3A and 3B are schematic configuration diagrams of an electroniccomponent according to a third embodiment of the invention; FIG. 3A is aplan view and FIG. 3B is a cross-sectional view taken along line B-B ofFIG. 3A.

FIGS. 4A and 4B are schematic diagrams showing an electronic apparatusincluding the electronic component according to the invention; FIG. 4Ais a perspective view showing the configuration of a mobile (ornotebook) personal computer and FIG. 4B is a perspective view showingthe configuration of a mobile phone (PHS is also included).

FIG. 5 is a perspective view showing the configuration of a digitalcamera as an electronic apparatus including the electronic componentaccording to the invention.

FIG. 6 is a perspective view showing the configuration of a vehicle as amoving object including the electronic component according to theinvention.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, embodiments of the invention will be described in detailwith reference to the accompanying drawings.

Electronic Component First Embodiment

An example of an electronic component 1 according to a first embodimentof the invention includes a crystal oscillator with a thermostat (OCXO),and a description will be given with reference to FIGS. 1A and 1B.

FIGS. 1A and 1B are schematic diagrams showing the configuration of theelectronic component 1 according to the first embodiment of theinvention. FIG. 1A is a plan view, and FIG. 1B is a cross-sectional viewtaken along line A-A shown in FIG. 1A. Meanwhile, FIG. 1A shows a statewhere a cover 14 is removed, for convenience of description of theinternal configuration of the electronic component 1.

As shown in FIGS. 1A and 1B, the electronic component 1 is configured toinclude a wiring substrate 20 on which a circuit component 30 isdisposed, the circuit component 30 including an oscillation circuit 32and a resonator element 34, a heating element 40, such as a powertransistor or a resistance heating element, which heats the circuitcomponent 30, a first support 50 and a second support 60 which areelectrically connected to the circuit component 30 through a wiring, anda container 10 including a base 12 and a cover 14. Meanwhile, the insideof the container 10 is airtightly sealed with a decompressed atmospheresuch as a vacuum, or an inert gas atmosphere such as nitrogen, argon, orhelium.

A wiring pattern (not shown) is formed on principal planes of two sidesof the wiring substrate 20. The circuit component 30 including theoscillation circuit 32 and the resonator element 34 such as an SC cutquartz crystal piece and the heating element 40 such as a powertransistor or a resistance heating element are disposed on the principalplanes. In the wiring substrate 20, the first support 50, serving as alead terminal, which is connected to a mounting substrate (not shown)having the electronic component 1 mounted thereon and the second support60 serving as a lead terminal for adjustment or inspection are connectedto a wiring using a conductive bonding member such as solder or aconductive adhesive. In addition, the wiring substrate 20 having thecircuit component 30 and the heating element 40 disposed thereon is madeto be separated from the base 12 of the container 10 by the firstsupport 50 and the second support 60 so that heat of the heating element40 is prevented from being directly radiated to the container 10.Meanwhile, in this embodiment, the resonator element 34 such as an SCcut quartz crystal resonator element is used as the circuit component30, but the invention is not limited thereto. For example, it is alsopossible to use a resonator in which the resonator element 34 isairtightly sealed within a container in a decompressed atmosphere suchas a vacuum or an inert gas atmosphere such as nitrogen, argon, orhelium. Meanwhile, the circuit component 30 includes a control circuitfor controlling the heating element 40 or the oscillation circuit 32 anda memory circuit. The second support 60 is used as a terminal forsupplying data for adjusting the control circuit to the memory circuitor is used as a terminal for inspecting the control circuit that outputsdata from the memory circuit.

The first support 50 and the second support 60 include a protrusionportion 52 and a protrusion portion 62, respectively, which protrude ona surface opposite to the surface of the base 12 on which the wiringsubstrate 20 is disposed. The protrusion portion 62 of the secondsupport 60 is shorter than the protrusion portion 52 of the firstsupport 50. For this reason, when the electronic component 1 is mountedon the mounting substrate, it is possible to prevent the protrusionportion 62 of the second support 60 from coming into contact with themounting substrate. Thus, it is possible to reduce the outflow of heatof the heating element 40 to the mounting substrate along the protrusionportion 62 of the second support 60 and to reduce the radiation of heatof the heating element to the outside, thereby allowing the electroniccomponent 1 with a high frequency stability to be obtained.

The base 12 of the container 10 is provided with a plurality ofprojection portions 16 on a surface opposite to the surface of the base12 on which the wiring substrate 20 is disposed, the projection portionbeing longer than the protrusion portion 62 of the second support 60 ina direction in which the protrusion portion 62 of the second support 60protrudes. For this reason, when the electronic component 1 is mountedon the mounting substrate, the projection portion 16 serving as astopper can prevent the protrusion portion 62 of the second support 60and the mounting substrate from coming into contact with each other.Thus, it is possible to reduce the radiation of heat of the heatingelement 40 to the outside, thereby allowing the electronic component 1having a high frequency stability to be obtained. Meanwhile, aconstituent material of the projection portion 16 is not particularlylimited, but it is also possible to further reduce the radiation of heatof the heating element 40 to the outside along the container 10 by usinga constituent material having a low heat conductivity, for example, aninsulating material such as glass or a resin, or a material mixed withglass and a resin.

In addition, the base 12 is provided with penetrating portions (holes).The first support 50 and the second support 60 are inserted into theportions and are connected (hermetic seal) to the base through aninsulating member 70 such as a resin or glass having a low heatconductivity. For this reason, the first support 50, the second support60, and the container 10 are connected to each other by the insulatingmember 70 such as a resin or glass having a low heat conductivity, andthus it is possible to reduce the radiation of heat of the heatingelement 40 to the container 10 along the first support 50 and the secondsupport 60. For this reason, it is possible to obtain the electroniccomponent 1 with a high frequency stability.

Meanwhile, in the above-described embodiment, the first support 50 andthe second support 60 having substantially the same thickness are shownand described. However, the second support 60 may be configured to havea smaller thickness than that of the first support 50. With such aconfiguration, the heat conduction can be reduced as compared with thefirst support 50, and thus it is possible to further reduce heatemission from the second support 60 which is disposed near the heatingelement 40. For this reason, it is possible to reduce the radiation ofheat of the heating element 40 to the outside, thereby allowing theelectronic component 1 with a high frequency stability to be obtained.

The constituent materials of the base 12 of the container 10, the cover14, the first support 50, and the second support 60 are a metal, and aniron-based alloy having a low heat conductivity such as, for example, 42alloy (iron-nickel alloy) subjected to nickel plating is suitable.

In addition, the wiring substrate 20 is formed of a material such as aglass epoxy resin or ceramics having an insulating property. Inaddition, the wiring provided in the wiring substrate 20 is formed by amethod of etching a substrate of which the entire surface is coated withcopper foil or a method of performing screen printing of a metal wiringmaterial such as tungsten (W) or molybdenum (Mo) on a substrate, bakingthe material, and performing plating of nickel (Ni) or gold (Au)thereon.

Further, in the above-described embodiment, an SC cut quartz crystalpiece is used as the resonator element 34. However, the invention is notlimited thereto, and an AT cut quartz crystal piece may be used.

Second Embodiment

Next, an electronic component 1 a according to a second embodiment ofthe invention will be described with reference to FIG. 2.

FIG. 2 is a schematic configuration diagram of the electronic component1 a according to the second embodiment of the invention, and is anenlarged cross-sectional view of the vicinity of a second support 60 a.

Hereinafter, in the second embodiment, a description will be given witha focus on the differences from the first embodiment mentioned above,and a description of the same matters will be omitted.

As shown in FIG. 2, the electronic component 1 a according to the secondembodiment is different from the electronic component 1 according to thefirst embodiment in that the protrusion portion 62 of the second support60 has a fixed thickness, whereas a protrusion portion 62 a of a secondsupport 60 a is constituted by a supporting portion 64 and an end 66 andthat the end 66 is thicker than the supporting portion 64.

With such a configuration, when the second support 60 a is used as alead terminal for adjustment or inspection, there is a tendency for aprobe for adjustment or inspection to come into contact with the secondsupport. Thus, it is possible to prevent an adjustment or inspectionerror from occurring due to contact failure with the probe, therebyallowing the electronic component 1 a with higher accuracy to beobtained. In addition, similarly to the first embodiment, when theelectronic component 1 a is mounted on a mounting substrate, theprotrusion portion 62 a of the second support 60 a does not come intocontact with the mounting substrate. Thus, even when the end 66 isthicker than the supporting portion 64 of the protrusion portion, it ispossible to reduce the outflow of heat of a heating element 40 to themounting substrate along the end 66 and to reduce the radiation of heatof the heating element to the outside, thereby allowing the electroniccomponent 1 a with a high frequency stability to be obtained.

Third Embodiment

Next, an electronic component 1 b according to a third embodiment of theinvention will be described with reference to FIGS. 3A and 3B.

FIGS. 3A and 3B are schematic configuration diagrams of the electroniccomponent 1 b according to the third embodiment of the invention. FIG.3A is a plan view, and FIG. 3B is a cross-sectional view taken alongline B-B of FIG. 3A. Meanwhile, FIG. 3A shows a state where a cover 14is removed, for convenience of description of the internal configurationof the electronic component 1 b.

Hereinafter, the third embodiment will be described with a focus on thedifferences from the first embodiment mentioned above, and a descriptionof the same matters will be omitted.

As shown in FIGS. 3A and 3B, the electronic component 1 b according tothe third embodiment is different from the electronic component 1according to the first embodiment in that an oscillation circuit 32 b, aresonator element 34 b, and a heating element 40 b disposed on principalplanes of two sides of a wiring substrate 20 are accommodated in asecond container 80 and are disposed on the wiring substrate 20.

With such a configuration, the oscillation circuit 32 b and theresonator element 34 b are disposed within the second container 80together with a heating element 40 b, and thus heat of the heatingelement 40 b is efficiently transferred to the oscillation circuit 32 band the resonator element 34 b, thereby allowing the electroniccomponent 1 b with higher accuracy to be obtained.

Electronic Apparatus

Subsequently, an electronic apparatus to which the electronic component1, the electronic component 1 a, or the electronic component 1 baccording to the embodiment of the invention is applied will bedescribed with reference to FIGS. 4A and 4B and FIG. 5.

FIGS. 4A and 4B are schematic diagrams showing an electronic apparatusincluding the electronic component 1, the electronic component 1 a, orthe electronic component 1 b according to the embodiment of theinvention. FIG. 4A is a perspective view showing the configuration of amobile (or notebook) personal computer 1100, and FIG. 4B is aperspective view showing the configuration of a mobile phone 1200 (PHSis also included).

In FIG. 4A, the personal computer 1100 is configured to include a mainbody 1104 having a keyboard 1102 and a display unit 1106 having adisplay portion 1000, and the display unit 1106 is supported so as to berotatable with respect to the main body 1104 through a hinge structure.The electronic component 1 functioning as an oscillator is embedded inthe personal computer 1100.

In FIG. 4B, the mobile phone 1200 includes a plurality of operationbuttons 1202, an earpiece 1204, and a mouthpiece 1206, and the displayportion 1000 is disposed between the operation buttons 1202 and theearpiece 1204. The electronic component 1, the electronic component 1 a,or the electronic component 1 b, which functions as an oscillator, isembedded in the mobile phone 1200.

FIG. 5 is a perspective view showing the configuration of a digitalcamera 1300 as an electronic apparatus including the electroniccomponent 1, the electronic component 1 a, or the electronic component 1b according to the embodiment of the invention. Meanwhile, connectionwith an external device is simply shown in FIG. 5.

The digital camera 1300 generates an imaging signal (image signal) byperforming photoelectric conversion of an optical image of a subjectusing an imaging element, such as a charge coupled device (CCD).

The display portion 1000 is provided on the back of a case (body) 1302in the digital camera 1300, so that display is performed on the basis ofan imaging signal of the CCD. The display portion 1000 functions as aviewfinder that displays a subject as an electronic image. In addition,a light receiving unit 1304 including an optical lens (imaging opticalsystem), a CCD, and the like is provided on the front side (back side inthe drawing) of the case 1302.

When a photographer checks a subject image displayed on the displayportion 1000 and presses a shutter button 1306, an imaging signal of theCCD at that point in time is transferred and stored in a memory 1308. Inthe digital camera 1300, a video signal output terminal 1312 and aninput/output terminal for data communication 1314 are provided on theside surface of the case 1302. In addition, as shown in the drawing, atelevision monitor 1330 is connected to the video signal output terminal1312 and a personal computer 1340 is connected to the input/outputterminal for data communication 1314 when necessary. Further, an imagingsignal stored in the memory 1308 may be output to the television monitor1330 or the personal computer 1340 by a predetermined operation. Theelectronic component 1, the electronic component 1 a, or the electroniccomponent 1 b, which functions as an oscillator, is embedded in thedigital camera 1300.

As described above, the electronic component 1, the electronic component1 a, or the electronic component 1 b, which has a high frequencystability, is used as the electronic apparatus, and thus it is possibleto provide the electronic apparatus with a higher performance.

Meanwhile, the electronic component 1 according to the embodiment of theinvention can be applied not only to the personal computer 1100 (mobilepersonal computer) of FIG. 4A, the mobile phone 1200 of FIG. 4B, and thedigital camera 1300 of FIG. 5 but also to electronic apparatuses such asan ink jet type discharge apparatus (for example, an ink jet printer), alaptop type personal computer, a television, a video camera, a carnavigation apparatus, a pager, an electronic organizer (an electronicorganizer with a communication function is also included), an electronicdictionary, an electronic calculator, an electronic game machine, aworkstation, a video phone, a television monitor for security,electronic binoculars, a POS terminal, medical equipment (for example,an electronic thermometer, a sphygmomanometer, a blood sugar meter, anelectrocardiographic measurement device, an ultrasonic diagnosticapparatus, and an electronic endoscope), a fish detector, variousmeasurement apparatuses, instruments (for example, instruments forvehicles, aircraft, and ships), a flight simulator, a device for amoving object communication base station, a storage area network devicesuch as a router or a switch, a local area network device, and atransmitter for a network.

Moving Object

Subsequently, a moving object to which the electronic component 1, theelectronic component 1 a, or the electronic component 1 b according tothe embodiment of the invention is applied will be described withreference to FIG. 6.

FIG. 6 is a perspective view showing the configuration of a vehicle 1400as a moving object including the electronic component 1, the electroniccomponent 1 a, or the electronic component 1 b according to theembodiment of the invention.

A gyro sensor configured to include the electronic component 1, theelectronic component 1 a, or the electronic component 1 b according tothe invention is mounted in the vehicle 1400. For example, as shown inFIG. 6, an electronic control unit 1402 having the gyro sensor,controlling a tire 1401 and the like, embedded therein is mounted in thevehicle 1400 as a moving object. In addition, as other examples, theelectronic component 1 can be widely applied to an electronic controlunit (ECU), such as a keyless entry, an immobilizer, a car navigationsystem, a car air-conditioner, an anti-lock brake system (ABS), anairbag, a tire pressure monitoring system (TPMS), an engine control, abattery monitor of a hybrid vehicle or an electric vehicle, and avehicle body position control system.

As described above, the electronic component 1, the electronic component1 a, or the electronic component 1 b, which has a high frequencystability, is used as the moving object, and thus it is possible toprovide the moving object with a higher performance.

While the electronic components 1, 1 a, and 1 b, the electronicapparatus, and the moving object according to the invention have beendescribed with reference to the illustrated embodiments, the inventionis not limited thereto, and the configuration of each portion may bereplaced with an arbitrary configuration having the same function. Inaddition, other arbitrary structures may be added to the invention. Inaddition, the embodiments described above may be appropriately combined.

The entire disclosure of Japanese Patent Application No. 2013-265011,filed Dec. 24, 2013 is expressly incorporated by reference herein.

What is claimed is:
 1. An electronic component comprising: a base; afirst support which comprises a first protrusion portion protruding fromthe base; a second support which comprises a second protrusion portionprotruding from the base; and a projection portion that is disposed soas to prevent the second protrusion portion from contacting a mountingsubstrate, wherein the second protrusion portion is shorter than thefirst protrusion portion, wherein the first support is a lead terminalconfigured to connect to the mounting substrate, wherein the secondsupport is a lead terminal not configured to connect to the mountingsubstrate, and wherein the electronic component has substantially arectangular shape in a plan view.
 2. The electronic component accordingto claim 1, further comprising a heating element.
 3. The electroniccomponent according to claim 2, further comprising a resonator element.4. The electronic component according to claim 3, wherein the resonatorelement is an SC cut quartz crystal piece.
 5. The electronic componentaccording to claim 3, wherein the resonator element is an AT cut quartzcrystal piece.
 6. The electronic component according to claim 3, whereinthe resonator element is disposed at a position close to the heatingelement.
 7. The electronic component according to claim 2, wherein thesecond support is disposed near the heating element.
 8. The electroniccomponent according to claim 2, further comprising a container includingthe base.
 9. The electronic component according to claim 8, wherein aninside of the container is air tightly sealed.
 10. The electroniccomponent according to claim 9, wherein a hermetic seal between eitherthe base and the first support and the base and the second support areinsulating member.
 11. The electronic component according to claim 1,the first support is arranged at a corner portion of the rectangularshape.
 12. The electronic component according to claim 11, the firstsupport is arranged at each corner portion of the rectangular shape. 13.The electronic component according to claim 11, a plurality of the firstsupports are arranged at a plurality of the corner portions of therectangular shape, and the second support is arranged at a position thatis not the corner portions of the rectangular shape.
 14. The electroniccomponent according to claim 2, further comprising a wiring substrate,wherein the heating element is mounted on the wiring substrate, whereinthe wiring substrate is connected to the first support and the secondsupport.
 15. The electronic component according to claim 1, wherein thesecond support is a lead terminal configured to allow for adjustment orinspection.
 16. The electronic component according to claim 1, furthercomprising: an oscillation circuit; a control circuit for controllingthe heating element or the oscillation circuit; and a memory circuit,wherein the second support is a terminal for supply data for adjustingthe control circuit to the memory circuit, or is a terminal forinspecting the control circuit that outputs data from the memorycircuit.
 17. The electronic component according to claim 1, wherein thebase has a projection portion which protrudes in a protrusion directionof the second protrusion portion, is longer than the second protrusionportion, and is shorter than the first protrusion portion.
 18. Theelectronic component according to claim 17, wherein the projectionportion is constituted by an insulating material.
 19. The electroniccomponent according to claim 1, wherein a thickness of the secondsupport is smaller than a thickness of the first support.
 20. Theelectronic component according to claim 1, wherein the second protrusionportion has a supporting portion and an end, and a thickness of the endis larger than that of the supporting portion.
 21. The electroniccomponent according to claim 1, wherein the first support and the secondsupport are penetrating the base and connected to the base through aninsulating member.
 22. The electronic component according to claim 1,further comprising a circuit component, wherein the circuit component iselectrically connected to the wiring substrate and includes anoscillation circuit and a resonator element.
 23. The electroniccomponent according to claim 2, further comprising a wiring substrate,an oscillation circuit and a resonator element, wherein the oscillationcircuit, the resonator element, and the heating element are disposedwithin a second container, and the second container is disposed on thewiring substrate.
 24. The electronic component according to claim 1,wherein the first support includes at least two lead terminals, whereinthe second support is disposed between the two lead terminals in a planview.
 25. An OCXO comprising the electronic component according toclaim
 1. 26. An OCXO comprising the electronic component according toclaim
 17. 27. An OCXO comprising the electronic component according toclaim
 22. 28. An electronic apparatus comprising the electroniccomponent according to claim
 1. 29. An electronic apparatus comprising:the electronic component according to claim 1; and the mountingsubstrate on which the electronic component is disposed, wherein thefirst support and the mounting substrate are connected to each other,and the second support and the mounting substrate are separated fromeach other.
 30. A moving object comprising the electronic componentaccording to claim
 1. 31. An electronic component comprising: acontainer comprising a base; a first support which penetrates the baseand comprises a first protrusion portion protruding from the base; asecond support which penetrates the base and comprises a secondprotrusion portion protruding from the base; and a projection portionthat is disposed so as to prevent the second protrusion portion fromcontacting a mounting substrate, wherein the second protrusion portionis shorter than the first protrusion portion, wherein the first supportis a lead terminal configured to connect to the mounting substrate,wherein the second support is a lead terminal not configured to connectto the mounting substrate.
 32. An electronic apparatus comprising: theelectronic component according to claim 31; and the mounting substrateon which the electronic component is disposed, wherein the first supportand the mounting substrate are connected to each other, and the secondsupport and the mounting substrate are separated from each other.
 33. Amoving object comprising the electronic component according to claim 31.